Epoxy Encapsulating/Moisture Resistant Resin Kit TP33/HP33
*** No room for the stock so selling cheap ***
This cured system provides excellent electrical encapsulation and moisture resistant barriers for electrical components and windings.
For small casting, applications e.g. Pattern making. The resin/hardener mix may be extended with mineral fillers i.e. Calcite, silica flour to reduce cost and lower the peak exotherm.
Furthermore, the resin/hardener mix may be thickened with WEST SYTEM 413 Microfibre blend to produce an excellent general-purpose epoxy adhesive.
Typically used for electrical casting, potting applications, electrical windings, Laminating, coating and as an adhesive.
Resin is mixed at a 1:4 ratio by weight. Once cured, mixture has an amber colour.
Kit includes Resin TP33 and Hardner HP33 that equates to 1.25L or 5L